Failure Analysis


Reliateck provides Failure Analysis Services for its customers. Most problems that occur with
microelectronic Devices can be detected with the Failure Analysis Techniques that we can
provide:

• I/V characterization (curve trace)
• Micro probing
• Pico probing up to 3 GHz
• Optical microscopic examination
• Chemical or mechanical decapsulation
• Real time X-ray
• Scanning Acoustic Microscopy (C-SAM)
• Scanning Electron Microscopy (SEM) systems
• Energy Dispersive X-ray analysis (EDX)
• Emission Microscopy
• Hot spot analysis
• Chemical deprocessing
• Plasma etching
• Parallel lapping
• Cross sectioning
• Failure analysis reports

Failure Analysis Process Level

Level 1 

• External Visual Inspection
• Curve Trace
• X-Ray
• C-SAM
• FA Report

Level 2

• Decapsulation
• Optical Microscopy
• Probing
• Liquid Crystal/EMMI
• FA Report

Level 3

• Chemical Deprocessing
• Cross Sectioning
• SEM
• EDX
• Parallel Lapping
• FA Report